Method and apparatus for epoxy LOC die attachment

Details Method and apparatus for epoxy LOC die attachment Method and apparatus for epoxy LOC die attachment

2006-10-03

2006-10-03

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S783000

Reexamination Certificate

active

07115976

ABSTRACT:
A plurality of lead frames is supplied in a lead frame-by-lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead frame with the adhesive by holding the device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

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