Method and apparatus for epoxy loc die attachment

Details Method and apparatus for epoxy loc die attachment Method and apparatus for epoxy loc die attachment

2005-02-22

2005-02-22

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S119000, C438S123000, C257S665000, C257S676000, C257S678000

Reexamination Certificate

active

06858469

ABSTRACT:
A plurality of lead frames is supplied in lead frame by lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead frame with the adhesive by holding the device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4946874 (1990-08-01), Lee et al.
patent: 5031360 (1991-07-01), Farnworth et al.
patent: 5145886 (1992-09-01), Oxman et al.
patent: 5155066 (1992-10-01), Nguyen
patent: 5169879 (1992-12-01), Lee et al.
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5548091 (1996-08-01), DiStefano et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5563443 (1996-10-01), Beng et al.
patent: 5679194 (1997-10-01), Fjelstad et al.
patent: 5770706 (1998-06-01), Wu et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5807453 (1998-09-01), Smith et al.
patent: 5810926 (1998-09-01), Evers
patent: 5861678 (1999-01-01), Schrock
patent: 5865417 (1999-02-01), Harris et al.
patent: 5874322 (1999-02-01), Evers
patent: 5943557 (1999-08-01), Moden
patent: 5962862 (1999-10-01), Evers et al.
patent: 5984699 (1999-11-01), Waki et al.
patent: 6016004 (2000-01-01), Schrock
patent: 6051449 (2000-04-01), Schrock
patent: 6057402 (2000-05-01), Zhou et al.
patent: 6084311 (2000-07-01), Jiang et al.
patent: 6110805 (2000-08-01), Schrock et al.
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6121358 (2000-09-01), Dershem et al.
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6174752 (2001-01-01), Schrock
patent: 6353268 (2002-03-01), Cobbley et al.
patent: 10-144703 (1998-05-01), None

Affiliated with

Also associated with

Rating

Method and apparatus for epoxy loc die attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for epoxy loc die attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for epoxy loc die attachment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3473244