Method and apparatus for Epoxy loc die attachment

Details Method and apparatus for Epoxy loc die attachment Method and apparatus for Epoxy loc die attachment

1997-08-06

2000-04-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, H01L 2144

Patent

active

060514493

ABSTRACT:
A plurality of lead frames is supplied in lead frame by lead frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device to each lead frame with the adhesive by holding the device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

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