Method and apparatus for enveloping an electronic component

Details Method and apparatus for enveloping an electronic component Method and apparatus for enveloping an electronic component

1990-06-05

1992-02-11

Lusignan, Michael

Coating processes

Electrical product produced

Welding electrode

427 58, 427258, 4274071, 427421, 26427213, 26427214, 264279, 2642791, B05D 306, B05D 512, B05D 102, B29C 0000

Patent

active

050874799

ABSTRACT:
A method forming a compressible intermediate layer between a chip and a chip envelope provides that an ultraviolet-curable gel that is metered onto the chip with a multiple needle arrangement. The multiple needle arrangement is conducted over the chip surface with varying moving directions and, under certain circumstances, with varied speeds as well. After the application of the gel, the layer is pre-cured on a strips of ultraviolet light that follows the multiple needle arrangement at a defined distance therefrom.

REFERENCES:
patent: 3579821 (1971-05-01), Kurisu
patent: 3622419 (1971-11-01), London et al.
patent: 4567006 (1986-01-01), Covington et al.
patent: 4711688 (1987-12-01), Pienimaa
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 4880663 (1989-11-01), Shimada
patent: 4927580 (1990-05-01), Nasu et al.

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