Method and apparatus for enhanced packaging for PC security

Details Method and apparatus for enhanced packaging for PC security Method and apparatus for enhanced packaging for PC security

2011-08-16

2011-08-16

Dinh, Tuan T (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C361S784000

Reexamination Certificate

active

08000108

ABSTRACT:
A method having a socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with a one-time locking mechanism, a pin contact mechanism that, after initial locking, will detach the pins of the electrical component if further disturbed, or a moat around the base of the electrical component for disposing an epoxy fastener. The moat may include a heating element to cure the epoxy or other glue. The socket may include an electrical component that allows detection of tampering with the socket.

REFERENCES:
patent: 4501461 (1985-02-01), Anhalt
patent: 4616895 (1986-10-01), Yoshizaki et al.
patent: 4620761 (1986-11-01), Smith et al.
patent: 4953930 (1990-09-01), Ramsey et al.
patent: 5358421 (1994-10-01), Petersen
patent: 6164999 (2000-12-01), McCutchan et al.
patent: 6190181 (2001-02-01), Affolter et al.
patent: 6347946 (2002-02-01), Trobough et al.
patent: 6535002 (2003-03-01), Haseyama et al.
patent: 6609923 (2003-08-01), Sato et al.
patent: 6712630 (2004-03-01), Davidov et al.
patent: 7121065 (2006-10-01), Christ
patent: 2004/0192104 (2004-09-01), Chiu
patent: 2005/0030718 (2005-02-01), Villanueva et al.
patent: 1994317630 (1994-11-01), None
patent: 1996097261 (1996-04-01), None
patent: 1998038972 (1998-02-01), None
patent: 2005347220 (2005-12-01), None
Written Opinion for PCT/US2008/066089 mailed Dec. 22, 2008.
International Search Report for PCT/US2008/066089 mailed Dec. 22, 2008.
“Ball/Land Grid Array Sockets,” http://e-tec.ch/v2/IC—Products/IC—BGA-qui—060325.pdf.
“How to Install an AMD Athlon or Duron Socket a Processor,” http://www.duxcw.com/digest/Howto/cpu/socka/1.html.
“Package Types for Mobile Intel Processors,” http://www.intel.com/support/processors/sb/CS-009864.htm.

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