Method and apparatus for endpoint detection for chemical mechani

Details Method and apparatus for endpoint detection for chemical mechani Method and apparatus for endpoint detection for chemical mechani

1998-07-17

1999-12-28

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 8, 451 9, 451288, 451398, 438692, B24B24900

Patent

active

060074051

ABSTRACT:
A chemical mechanical polisher for polishing a surface of a semiconductor wafer is disclosed. The polisher comprises: a polishing table for holding a polishing pad; a rotatable wafer chuck for holding said semiconductor wafer against said polishing pad; an electrical lapping guide secured to said wafer chuck, said electrical lapping guide comprising: a polishable resistive sensor that has a variable resistance dependent upon the amount of material removed from said resistive sensor during polishing; and a bias means for applying a bias to said resistive sensor such that said resistive sensor is in contact with said polishing pad during polishing; a resistance sensing means for determining said variable resistance of said resistive sensor; and a microprocessor for determining the amount of material polished from said resistive sensor based upon said variable resistance.

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