Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-06-08
2000-08-22
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
216 89, 451287, 438692, B24B 500
Patent
active
061066621
ABSTRACT:
An apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-hole in a polish pad, a light source, a fiber optic cable, a light sensor, and a computer. A pad assembly includes the polish pad, a pad backer, and a pad backing plate. The pad backer includes a pinhole and a canal that holds the fiber optic cable. The pad backer holds the polish pad so that the through-hole is coincident with the pinhole opening. A wafer chuck holds a semiconductor wafer so that the surface to be polished is against the polish pad. The light source provides light within a predetermined bandwidth. The fiber optic cable propagates the light through the through-hole opening to illuminate the surface as the pad assembly orbits and the chuck rotates. The light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal. For metal film polishing, the endpoint signal is based upon the intensities of two individual wavelength bands. For dielectric film polishing, the endpoint signal is based upon fitting of the reflected spectrum to an optical reflectance model to determine remaining film thickness. The computer compares the endpoint signal to predetermined criteria and stops the polishing process when the endpoint signal meets the predetermined criteria.
REFERENCES:
patent: 5101602 (1992-04-01), Hashimoto
patent: 5131752 (1992-07-01), Yu et al.
patent: 5157877 (1992-10-01), Hashimoto
patent: 5552327 (1996-09-01), Bachmann et al.
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5558563 (1996-09-01), Cote et al.
patent: 5564965 (1996-10-01), Tanaka et al.
patent: 5650039 (1997-07-01), Talieh
patent: 5664989 (1997-09-01), Nakata et al.
patent: 5725420 (1998-03-01), Torii
patent: 5735731 (1998-04-01), Lee
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5769691 (1998-06-01), Fruitman
patent: 5788560 (1998-08-01), Hashimoto et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5795218 (1998-08-01), Doan et al.
patent: 5807161 (1998-09-01), Manor et al.
patent: 5872633 (1999-02-01), Holzapfel et al.
Shi, F.G. and Zhao, B., "Modeling of chemical-mechanical polishing with soft pads," Appl. Phys. (1998), pp. 249-252.
Fiber Optic Rotary Joint Model 214, Focal Technologies, Inc. (1998).
Fiber Optic Rotary Joint Model 215 Ultra-compact, 2 channels, Focal Technologies Inc. (1998).
Adams John A.
Barns Christopher E.
Bibby, Jr. Thomas Frederick Allen
Eaton Robert A.
Hannes Charles
Bueker Richard
Powell Alva C
SpeedFam-IPEC Corporation
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