Method and apparatus for encapsulation of chemically sensitive f

Details Method and apparatus for encapsulation of chemically sensitive f Method and apparatus for encapsulation of chemically sensitive f

1982-01-08

1984-05-15

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

339 17F, H05K 500

Patent

active

044490119

ABSTRACT:
Semiconductor chips carrying chemically sensitive field effect devices are encapsulated by tape automated bonding techniques, wherein one tape layer has a beam lead pattern disposed thereon which terminates in the chip bonding pad pattern over an opening in the tape. A tape layer for sealably covering the beam lead pattern and the chip has openings which are respectively coincident with the chemically selective membrane systems of the field effect devices.

REFERENCES:
patent: 3393392 (1968-07-01), Shelley
patent: 4020830 (1977-05-01), Johnson et al.
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4135038 (1979-01-01), Takami et al.

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