Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
Reexamination Certificate
2011-06-28
2011-06-28
Silverman, Stanley (Department: 1736)
Compositions
Electrically conductive or emissive compositions
Elemental carbon containing
C252S500000, C428S308400, C428S316600, C428S297400, C428S301100, C428S300100, C174S350000, C174S358000, C427S058000
Reexamination Certificate
active
07968012
ABSTRACT:
Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.
REFERENCES:
patent: 4034375 (1977-07-01), Wallin
patent: 4596670 (1986-06-01), Liu
patent: 4645566 (1987-02-01), Kato et al.
patent: 4678699 (1987-07-01), Kritchevsky et al.
patent: 5071699 (1991-12-01), Pappas et al.
patent: 5366664 (1994-11-01), Varadan et al.
patent: 5382384 (1995-01-01), Baigrie et al.
patent: 6090728 (2000-07-01), Yenni et al.
patent: 6096413 (2000-08-01), Kalinoski et al.
patent: 6537359 (2003-03-01), Spa
patent: EP 643551 (1995-03-01), None
patent: 59225927 (1984-12-01), None
patent: 01257047 (1989-10-01), None
GE News Release, PR #43-99, Oct. 6, 1999. pp. 1-2.
McFadden Jeff
McNally Frank T.
Rapp Martin L.
Harness & Dickey & Pierce P.L.C.
Laird Technologies Inc.
Silverman Stanley
Vijayakumar Kallambella
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