Method and apparatus for EMI/RFI shielding an infrared energy re

Metal fusion bonding – Process – Plural joints

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2281802, 228201, 228242, 29840, 29841, 219 1055D, 219 8513, 361424, 174 35TS, B23K 3102, H05K 900

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active

048384755

ABSTRACT:
An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).

REFERENCES:
patent: 2570440 (1951-10-01), Frieberg
patent: 3020635 (1962-02-01), Redgrift
patent: 4144404 (1979-03-01), De Groef et al.
patent: 4370515 (1983-01-01), Donaldson
patent: 4621180 (1986-11-01), Kristof et al.
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4722471 (1988-02-01), Gray et al.

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