Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2006-09-18
2009-12-08
Garber, Charles D. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S108000, C257SE21514
Reexamination Certificate
active
07629202
ABSTRACT:
A method and apparatus for providing ESD protection of an integrated circuit using a temporary conductive coating. The method deposits a temporary conductive coating upon a chip die between contacts to be protected such that a conductive path is created between contacts, provides a carrier substrate that is then bonded to the chip die and then the conductive coating is deactivated to ready the device for use. The deactivation of the conductive coating may involve physical removal of the conductive coating (or a portion thereof), oxidation of the conductive coating to form a non-conductive coating, or some other process to interrupt the conductive path between contacts. The apparatus of the invention is a chip having a temporary conductive coating deposited thereon to protect the integrated circuit from ESD events.
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Morf Thomas E.
Riel Heike E
Weiss Jonas R
Garber Charles D.
International Business Machines - Corporation
Isaac Stanetta D
Kaufman Stephen C.
Neff Daryl K.
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