Method and apparatus for electroplating a metallic deposit on in

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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C25D 1700

Patent

active

047707542

ABSTRACT:
Method for electroplating a metallic deposit on interconnected or bandoliered elongate metallic and/or metallized products, whereby providing for non-conductive masking devices between the products, of which at least the parts which are in contact with the products consist of resilient material while, after providing for the said masking devices, the products are submitted to a contact with an electrolyte.

REFERENCES:
patent: 4376017 (1983-03-01), Urion
patent: 4405410 (1983-09-01), Sebastien

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