Method and apparatus for electroplating

Details Method and apparatus for electroplating Method and apparatus for electroplating

1981-09-11

1985-04-30

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 141, 204206, 204237, 204275, 204284, C25D 706, C25D 1712

Patent

active

045142661

ABSTRACT:
A method and apparatus for quality high speed electrical plating of one or both sides of a metallic workpiece 12 wherein a combined consumable-non-consumable anode system so provides a uniformity of metallic deposition at relatively high speeds irrespective of the consumable anode 15 contour. A metal ion containing plating solution flows into contact with a workpiece through apertures 86 in the non-consumable anode 16 while metal ion concentration is maintained. The consumable-non-consumable anode system is used in a vertical or horizontal submerged cell configuration.

REFERENCES:
patent: 4169780 (1979-02-01), Stiker et al.
patent: 4183799 (1980-01-01), Sellitto et al.
patent: 4347115 (1982-08-01), Espenhahn
patent: 4367125 (1983-01-01), Avellone

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