Method and apparatus for electronic component mounting

Details Method and apparatus for electronic component mounting Method and apparatus for electronic component mounting

2011-03-01

2011-03-01

Arbes, C. J (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S741000, C029S832000, C029S833000

Reexamination Certificate

active

07895736

ABSTRACT:
A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.In component mount operation for taking chips of component types A, B, and C out of a component supply portion by means of a single mount head and mounting the chips on two substrates held by a first lane and a second lane, when a subsequently-carried-in subsequent substrate has come to be able to undergo component mount operation before completion of processing pertaining to a preceding substrate mount process in which component mount operation is carried out on a previously-carried-in preceding substrate among a plurality of substrates, processing pertaining to a subsequent substrate mount process is started by taking, as mount start components, chips already serving as targets of component mount operation for the preceding substrate at this timing, and processing pertaining to the preceding substrate mount process during which mounting is not yet completed is continually carried out. Thereby, the frequency of operation required with switching of a component type, such as replacement of a nozzle, can be reduced.

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International Search Report for PCT/JP2007/054857; completed Apr. 4, 2007.

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