Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent
1992-08-12
1993-11-02
Rosenbaum, Mark
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
228105, B23K 3704
Patent
active
052577147
ABSTRACT:
The method and apparatus of the present invention permit the visual inspection of electronic component leads during the mounting thereof. A hot bar thermode or other mounting tool is provided having a plurality of thermally activatable blades. A vacuum chuck and associated vacuum pump are utilized to selectively mount an integrated circuit device such that the conductive leads of the device are disposed adjacent to the lower surfaces of the thermally activatable blades. A low angle light source is then utilized to illuminate the integrated circuit device conductive leads such that a high contrast is created between the conductive leads and the lower surface of the thermally activatable blades, in order to permit an accurate visual inspection of the conductive leads. In one embodiment of the present invention, the lower surfaces of the thermally activatable blades are given a uniform grain by lapping those surfaces in a single direction to minimize the specularity of these surfaces and the angle of illumination is adjusted to enhance the contrast between the conductive leads and the lower blade surfaces. A camera disposed below the hot bar thermode may then be utilized to permit remote visual inspection of the conductive leads of an integrated circuit device while it is present within the mounting tool.
REFERENCES:
patent: 3641648 (1972-02-01), Kalberman
patent: 3713575 (1973-01-01), Cushman
patent: 4604648 (1986-08-01), Kley
patent: 4675993 (1987-06-01), Harada
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4728195 (1988-03-01), Silver
patent: 4813588 (1989-03-01), Srivastava
patent: 4848639 (1989-07-01), Belanger, Jr.
patent: 4970380 (1990-11-01), Miller
patent: 5033665 (1991-07-01), Todd
IBM Technical Disclosure Bulletin, vol. 30, No. 4, Sep. 1987, pp. 1506-1508, "Optical Inspection/Alignment of Multisides Component Connections".
IBM Bulletin, vol. 32 No. 11 Apr. 1990. Illuminator for integrated circuits, pp. 459-461.
IBM Bulletin, vol. 28 No. 11 Apr. 1986. Chip-Orientation detector, 5083-5084.
IBM Bulletin, vol. 22 No. 9 Feb. 1980. Inspection Technique for Solder Reflow Pad, p. 4068.
IBM Bulletin, vol. 31 No. 10 Mar. 1989 Assembly Technique for Placing Electronic Components, pp. 222-228.
Beers Gregory E.
Bogaczyk Francis W.
Rubsam Michael A.
Wattenbarger Henry E.
Dillon Andrew J.
International Business Machines - Corporation
Miner James
Rosenbaum Mark
LandOfFree
Method and apparatus for electronic component lead inspection does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for electronic component lead inspection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for electronic component lead inspection will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1752706