Method and apparatus for electrolytically plating copper

Electrolysis: processes – compositions used therein – and methods – Product produced by electrolysis involving electrolytic...

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Details

205291, 205295, 204242, 204275, 106 118, C25D 700, C25D 338, C25D 1700

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active

055164145

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The present invention relates generally to the plating field and, more particularly, to a unique method and apparatus for plating copper onto a base metal such as steel utilizing an insoluble electrode and copper ions from a plating solution.


BACKGROUND OF THE INVENTION

Steel, plated with copper, is utilized for a wide variety of applications. For example, copper plated steel wire is utilized for tire cord in steel radial tires, in high pressure hoses and belts and has other related applications.
Prior art electrolytic copper plating methods have utilized plating solutions commonly formed from copper pyrophosphate and copper sulfate. The copper pyrophosphate solution is understood to be pH neutral and is often preferred over the pH acidic solution of copper sulfate. No matter which solution is selected, however, prior art apparatus and methods have utilized soluble copper anodes.
For example, oxygen-free copper metal is usually utilized in a soluble anode in a copper pyrophosphate plating solution. The anode is placed on a positive charged electrode basket made of titanium or stainless steel. During plating, the anode changes shape. More specifically, copper dissolves from the anode to replace copper consumed from the solution to plate the steel. This change in shape, disadvantageously, results in relatively large variations in the current density at the steel being plated (functional cathode). This leads to uneven plating on the steel. Accordingly, plating quality is adversely effected.
An additional drawback to the utilization of soluble anodes is the need to periodically provide replacement as the copper of the anodes becomes exhausted. This is an inconvenient, relatively time consuming and usually unpleasant task. In many plating operations, it also may require some downtime which adversely effects productivity.
In others, and particularly continuous plating operations, "sparking" may occur during anode replacement. Sparking results when the anode simultaneously contacts both the electrode basket (positive charge) and the steel being plated (negative charge). Sparking creates a surface defect which is detrimental to the finish of the plated product.


SUMMARY OF THE INVENTION

Accordingly, it is a primary object of the present invention to provide an improved method and apparatus of copper plating specifically overcoming the above-described limitations and disadvantages of the prior art.
A more specific object of the present invention is to provide a novel copper plating method and apparatus providing significantly enhanced characteristics including more uniform plating over the entire surface being plated.
Still another object of the invention is to provide a method and apparatus for plating copper on steel that substantially eliminates the downtime and lost productivity associated with the replacement of soluble anodes in non-continuous plating operations.
Yet another object of the invention is to provide a plating method and apparatus utizling insoluble anodes so as to provide for the elimination of the sparking problem commonly occurring when soluble anodes as utilized in the prior art are replaced during continuous plating operations. As a result, the surface defects associated with sparking are virtually eliminated and, accordingly, a product of improved overall quality is produced.
A still further object of the invention is to provide a method and apparatus for copper plating steel wherein an insoluble anode is utilized and a separate copper source is added to the plating solution as required to provide a high quality, consistent and uniform plating operation. Further, this is achieved while eliminating the need to periodically replace the anodes thereby eliminating this unpleasant task.
Yet another object of the invention is to provide a copper plated steel product of improved quality produced in accordance with the present method.
Additional objects, advantages and other novel features of the invention will be set forth in part in the description that follows and in part wi

REFERENCES:
patent: 2250556 (1941-07-01), Stareck et al.
patent: 3475293 (1969-10-01), Haynes et al.
patent: 3775268 (1973-11-01), Fino et al.
patent: 3833486 (1974-09-01), Nobel et al.
patent: 4904354 (1990-02-01), Stavitsky et al.
patent: 5100517 (1992-03-01), Starinshak et al.
patent: 5143593 (1992-09-01), Ueno et al.
Chemical Abstracts, vol. 74, No. 22, May 31, 1971, 119457x.
Chemical Abstracts, vol. 107, No. 6, Aug. 10, 1987 48270t.
Chemical Abstracts, vol. 107, No. 6, Aug. 10, 1987 119457x.

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