Method and apparatus for electrolytic plating

Details Method and apparatus for electrolytic plating Method and apparatus for electrolytic plating

1990-03-26

1992-05-26

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204224R, C25D 1714

Patent

active

051164809

ABSTRACT:
Brush plating of metal objects with noble metals is improved by using a brush body of a rigid, dimensionally stable non-porous material such as titanium which will not distort appreciably at higher temperatures, e.g. 77.degree.-83.degree. C., together with a porous brush insert lying along the edge of the brush which bears against the workpiece and to which the plating electrolyte is supplied through branches from a conduit through which the electrolyte flows at a controlled rate. In this system the electrolyte is supplied to the work area at an elevated temperature, e.g. 77.degree.-87.degree. C., with resultant increase in the speed at which higher quality plating can be performed. Special forms of anode electrode and of the electrical contact to the workpiece are preferably also employed.

REFERENCES:
patent: 4404078 (1983-09-01), Francis
patent: 4452684 (1984-06-01), Palnik
patent: 4786389 (1988-11-01), Moffitt
patent: 4818349 (1989-04-01), Smith
patent: 4952296 (1990-08-01), Wingenfeld
U.S. application Ser. No. 07/242,300, of Kaiser, Wingenfeld, Holdt & Palnik, corresponding to German Patent No. DE 3720740-C1.

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