Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Utilizing brush or absorbent applicator
Reexamination Certificate
2005-06-07
2005-06-07
Valentine, Donald R. (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Utilizing brush or absorbent applicator
C205S659000, C205S125000, C205S662000
Reexamination Certificate
active
06902659
ABSTRACT:
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
REFERENCES:
patent: 3779887 (1973-12-01), Gildone
patent: 3595089 (1976-05-01), Watts
patent: 3959089 (1976-05-01), Watts
patent: 4431501 (1984-02-01), Leppanen
patent: 4609450 (1986-09-01), Seimiya et al.
patent: 4610772 (1986-09-01), Palnik
patent: 5024735 (1991-06-01), Kadija
patent: 5171412 (1992-12-01), Talieh et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5700366 (1997-12-01), Steblianko et al.
patent: 5755859 (1998-05-01), Brusic et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5833820 (1998-11-01), Dubin
patent: 5863412 (1999-01-01), Ichinose et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5933753 (1999-08-01), Simon et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6210554 (2001-04-01), Kosaki et al.
Contolini, R.C., et al., “Electrochemical Planarization for Multilevel Metallization”, Sep. 1994, pp. 2503-2510.
Madore, C., et al., “Blocking Inhibitors in Catholic Leveling,”Theoretical Analysis, Dec. 1996, pp. 3927-3942.
Steigerwald, J.M., et al., “Pattern Geometry Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures”, Oct. 1994, pp. 2842-2848.
West, A.C., et al., “Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and Vias”, Sep. 1998, pp. 3070-3073.
ASM Nutool, Inc.
Knobbe Martens & Olson Bear LLP.
Valentine Donald R.
LandOfFree
Method and apparatus for electro-chemical mechanical deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for electro-chemical mechanical deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for electro-chemical mechanical deposition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3508620