Method and apparatus for electrically insulating heat sinks in e

Details Method and apparatus for electrically insulating heat sinks in e Method and apparatus for electrically insulating heat sinks in e

1995-09-14

1998-08-04

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, H01L 2144

Patent

active

057892792

ABSTRACT:
A method and apparatus for electrically insulating heat sinks in electronic power devices that includes the formation of an insulating layer on the face of the electronic device having the heat sink. The insulating layer may be formed from an epoxy resin, commonly known as "solder mask" in the manufacture of printed circuits.

REFERENCES:
European Search Report from European Patent Application Serial No. 94830442.3, filed Sep. 20, 1994.

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