Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-04-11
1995-12-19
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361807, 228254, 29840, 174263, H05K 702
Patent
active
054774195
ABSTRACT:
A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.
REFERENCES:
patent: 4914814 (1990-04-01), Behun et al.
patent: 5186383 (1993-02-01), Melton et al.
Hodson, "Dispensing Surface Mount Adhesives and Solder Pastes", Electronic Packaging and Production, Newton, Mass., vol. 31, No. 11, pp. 36-40, Nov. 1990.
Hertz et al, "Solder Embossed PCB Location For Debossed Component", Motorola Technical Developments, Schaumburg, Ill., vol. 16, pp. 89-90, Aug. 1992.
Fujita Hiroyuki
Goodman Thomas W.
Murakami Yoshikazu
Murphy Arthur T.
Picard Leo P.
Sony Corporation
Whang Y.
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