Method and apparatus for efficient conduction cooling of surface

Details Method and apparatus for efficient conduction cooling of surface Method and apparatus for efficient conduction cooling of surface

1998-07-31

2000-05-16

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 174 163, 257713, 361710, 361715, 361717, H05K 720

Patent

active

060645733

ABSTRACT:
A plurality of heat-conducting compressible button contacts (10) between a heatsink (28) and an electronic part, e.g., a printed wiring board (22) or integrated circuit (24), to be cooled. A thin plate (16) and/or indentations (44, 44') in the heatsink are preferably used to support the heat-conducting buttons. Each heat-conducting button contact is placed in compression, generally, for example, by the heatsink. A thermal path is thus provided between the part and the heatsink. Differently sized compressible button contacts are used to accommodate disparate heights between the heat sink and surfaces on components of the electronic part.

REFERENCES:
patent: 5548482 (1996-08-01), Hatauchi et al.
Metreaud, IBM Tech Disl. Bul. "Air-Cooled Semiconductor Chip Module Configuration", vol. 20, No. 7, pp. 2697-2698, Dec. 1977.
Metreaud et al, IBM Tech. Disl. Bul. "Air-Cooled Semiconductor Chip Module Configuration", vol. 20, No. 7, pp. 2695-2696, Dec. 1977.
Brochure entitled "CIN::APSE.TM. High Density Interconnect Technology" bearing an identification "10M894 CA-10"; published by Cinch, a Division of Labinal Components & Systems, Inc. No Known Date.

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