Method and apparatus for dynamic multi-line bonding in...

Details Method and apparatus for dynamic multi-line bonding in... Method and apparatus for dynamic multi-line bonding in...

2002-11-07

2008-07-29

Chan, Wing F (Department: 2619)

Multiplex communications

Data flow congestion prevention or control

Control of data admission to the network

C370S420000, C370S485000

Reexamination Certificate

active

07406042

ABSTRACT:
A bundler, un-bundler and sequencer for use in controlling and driving opposing sets of logical or physical modems to drive multiple-subscriber lines with multiple communication channels. The sequencer determines subscriber requirements such as maximum and minimum bandwidth and quality of service. The sequencer also determines bandwidth availability and status of multiple subscriber lines from which a bundle may be formed. The bundler couple to the sequencer and implement header or headerless insertion of multiple channels in round robin sequence into the X-DSL frames at data rates which correspond with subscriber requirements. The un-bundler reverses the process of the bundler and passes the appropriate packet data onto the corresponding network.

REFERENCES:
patent: 4864567 (1989-09-01), Giorgio
patent: 5144625 (1992-09-01), Cain et al.
patent: 6175570 (2001-01-01), Cukier et al.
patent: 6188669 (2001-02-01), Bellenger
patent: 6324184 (2001-11-01), Hou et al.
patent: 6754221 (2004-06-01), Whitcher et al.
patent: 6754233 (2004-06-01), Henderson et al.
patent: 6798769 (2004-09-01), Farmwald
patent: 6963579 (2005-11-01), Suri
patent: 7133441 (2006-11-01), Barlev et al.
Richard Cam et al., Inverse Multiplexing for ATM (IMA) Specification Version 1.1, Mar. 1999, The ATM Forum Technical Committee.

Affiliated with

Also associated with

Rating

Method and apparatus for dynamic multi-line bonding in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for dynamic multi-line bonding in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for dynamic multi-line bonding in... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3969575