Method and apparatus for dynamic adjustment of a sampling...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

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C324S765010, C716S030000, C702S117000, C257SE21521

Reexamination Certificate

active

07445945

ABSTRACT:
The present invention provides a method and apparatus for dynamic adjustment of a sampling plan. The method includes accessing wafer electrical test data associated with at least one workpiece that has been processed by at least one processing tool. The method also includes determining, based on the wafer electrical test data, at least one sampling plan for at least one measurement device configured to measure at least one parameter associated with workpieces processed by the at least one processing tool.

REFERENCES:
patent: 6124725 (2000-09-01), Sato
patent: 2002/0152046 (2002-10-01), Velichko et al.
patent: 2006/0236294 (2006-10-01), Saidin et al.
patent: 2007/0112538 (2007-05-01), Velichko et al.

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