Method and apparatus for drying semiconductor wafers without for

Details Method and apparatus for drying semiconductor wafers without for Method and apparatus for drying semiconductor wafers without for

1998-01-20

2000-05-02

Wilson, Pamela A.

Drying and gas or vapor contact with solids

Process

Gas or vapor contact with treated material

34 78, F26B 300

Patent

active

060557435

ABSTRACT:
A method and an apparatus for drying a semiconductor wafer. The semiconductor wafer is first dipped in a liquid with a volatility higher than water and which is miscible with water. The dipped semiconductor wafer is then delivered in an IPA dryer to carry out the drying process. The drying process includes evaporating isopropyl alcohol to obtain a vapor and condensing the IPA vapor on the surface of the semiconductor wafer. The IPA is heated and vaporized by a hot plate disposed at the bottom of the IPA dryer. The condenser is mounted on the inner peripheral surface of the IPA dryer and surrounds the semiconductor wafer, which is supported by a holder.

REFERENCES:
patent: 4090307 (1978-05-01), Gollmick et al.
patent: 5443540 (1995-08-01), Kamikawa

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