Method and apparatus for drying semiconductor wafers

Details Method and apparatus for drying semiconductor wafers Method and apparatus for drying semiconductor wafers

1984-07-23

1985-12-24

Schwartz, Larry I.

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

34 58, 118 52, 414744B, F26B 508

Patent

active

045597189

ABSTRACT:
A semiconductor wafer is held on a first rotating element in a manner having a first portion of one surface of the wafer stuck on the first rotating element. The first rotating element is rotated together with the wafer thus held thereon to remove moisture from surface portions of the wafer other than the first portion. Then, the wafer is held on a second rotating element in a manner having a second portion of the one surface of the wafer stuck on the second rotating element. The second rotating element is rotated together with the wafer thus held thereon to remove moisture from the surfaces of the wafer including at least the first portion thereof, thereby completely drying the wafer.

REFERENCES:
patent: 3730134 (1973-05-01), Kadi
patent: 4280689 (1981-07-01), Frosch et al.
patent: 4313266 (1982-02-01), Tam

Affiliated with

Also associated with

Rating

Method and apparatus for drying semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for drying semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for drying semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1472097