Method and apparatus for drying semiconductor wafers

Details Method and apparatus for drying semiconductor wafers Method and apparatus for drying semiconductor wafers

1994-07-15

1996-09-17

Kastler, Scott

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 19, B08G 312

Patent

active

055564798

ABSTRACT:
A method for drying semiconductor wafers produces ultra-clean wafers without conventional drying chemicals. The method involves slowing draining a rinsing fluid from a processing tank while heating the wafer at the fluid interface as the wafer emerges from the rinsing fluid. The portion of the wafer surface at the fluid interface is heated to a temperature greater than the rinsing fluid to drive contaminant particles away from the wafer surface. An apparatus for performing this drying method also is provided.

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Koppenbrink, et al. "Particle Reduction on Silicon Wafers As A Result Of Isopropyl Alcohol Vapor Displacement Drying After Wet Processing", pp. 235-243. Dec. 1986.

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