Method and apparatus for drying granular materials

Drying and gas or vapor contact with solids – Material treated by electromagnetic energy – Microwave energy

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34412, 34 92, 34259, F26B 334

Patent

active

053415760

ABSTRACT:
The present invention discloses a method and an apparatus for drying granular materials by submitting them to dielectric heating by means of electromagnetic waves such as microwave, high frequency, etc. The granular materials to be dried are heated to the prescribed temperature with electromagnetic waves under a reduced pressure of a range not producing any glow discharge and then dried to the prescribed moisture percentage while passing through a pressure reducing process of a vacuum of higher degree. An apparatus for it is provided with a reduced pressure drying tank (1) having an electromagnetic wave generator (2), a main drying tank (30) communicated with said reduced pressure drying tank (1), and suction air sources (20), (20') which are provided respectively in the reduced pressure drying tank (1) and the main drying tank (30).

REFERENCES:
patent: 3834038 (1974-09-01), Janda
patent: 4347670 (1982-09-01), Wear et al.
patent: 4549053 (1985-10-01), Haugh
patent: 4626640 (1986-12-01), van der Heijden
patent: 4714812 (1987-12-01), Haagensen et al.
patent: 4954681 (1990-09-01), Ishikawa et al.
patent: 4957434 (1990-09-01), Radomsky

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for drying granular materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for drying granular materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for drying granular materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-23364

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.