Method and apparatus for drying a substrate having a resist film

Details Method and apparatus for drying a substrate having a resist film Method and apparatus for drying a substrate having a resist film

1995-04-04

1997-10-14

Rutledge, D.

Photography

Fluid-treating apparatus

Fluid application to one side only of photographic medium

396627, G03D 302, G03D 500

Patent

active

056781164

ABSTRACT:
A method of processing a substrate includes the steps of developing a substrate having a photo-sensitive resin film formed on its surface; washing the substrate by supplying washing liquid to the surface of the substrate, and rotating the substrate on a perpendicular axis in a horizontal plane and thereby drying the surface of the substrate, and atmosphere in which the substrate is placed is adjusted to be at a pressure lower than the atmospheric pressure in the step of drying the surface of the substrate. Instead of or in addition to this, washing liquid in which prescribed gas is dissolved may be used in the step of washing the substrate. In this case, in the step of drying the surface of the substrate, washing liquid supplied to the surface of the substrate is preferably supersaturated with gas. A substrate processing apparatus including a controller for implementing such a method is also disclosed.

REFERENCES:
patent: 5135608 (1992-08-01), Okutani
patent: 5273589 (1993-12-01), Griswold et al.
patent: 5326672 (1994-07-01), Tanaka et al.
patent: 5374502 (1994-12-01), Tanaka et al.
"Mechanism of Resist Pattern Collapse During Development Process", (Extended Abstracts, The 40th Spring Meeting, 1993); The Japan Society of Applied Physics and Related Societies, p. 509, 29p-L-3. (Translation attached to reference).
"The Collapse Mechanism of High Aspect Ratio Resist Patterns", (Extended Abstracts, The 40th Spring Meeting, 1993); The Japan Society of Applied Physics and Related Societies, p. 509, 29p-L-4. (Translation attached to reference).

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