Method and apparatus for dry-in, dry-out polishing and...

Details Method and apparatus for dry-in, dry-out polishing and... Method and apparatus for dry-in, dry-out polishing and...

2005-11-22

2005-11-22

Shakeri, Hadi (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S057000

Reexamination Certificate

active

06966821

ABSTRACT:
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

REFERENCES:
patent: 4020600 (1977-05-01), Day
patent: 4050954 (1977-09-01), Basi
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4193226 (1980-03-01), Gill, Jr. et al.
patent: 4313266 (1982-02-01), Tam
patent: 4502252 (1985-03-01), Iwabuchi
patent: 4653231 (1987-03-01), Cronkhite et al.
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4838150 (1989-06-01), Suzuki et al.
patent: 4851101 (1989-07-01), Hutchinson
patent: 4905425 (1990-03-01), Seikgawa et al.
patent: 4956944 (1990-09-01), Ando et al.
patent: 4984392 (1991-01-01), Seikgawa et al.
patent: 5094037 (1992-03-01), Hakomori et al.
patent: 5096477 (1992-03-01), Shinoda et al.
patent: 5140774 (1992-08-01), Onodera
patent: 5174067 (1992-12-01), Hasegawa et al.
patent: 5213118 (1993-05-01), Kamikawa
patent: 5254205 (1993-10-01), Tsutsumi et al.
patent: 5299584 (1994-04-01), Miyazaki et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5351360 (1994-10-01), Suzuki et al.
patent: 5361545 (1994-11-01), Nakamura
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5425793 (1995-06-01), Mori et al.
patent: 5431600 (1995-07-01), Murata et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5498294 (1996-03-01), Matsushita et al.
patent: 5518542 (1996-05-01), Matsukawa et al.
patent: 5582534 (1996-12-01), Shendon et al.
patent: 5616063 (1997-04-01), Okumura et al.
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5679060 (1997-10-01), Leonard et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5779520 (1998-07-01), Hayakawa
patent: 5885138 (1999-03-01), Okumura et al.
patent: 6110011 (2000-08-01), Somekh et al.
patent: 6213853 (2001-04-01), Gonzalez-Martin et al.
patent: 2505712 (1985-01-01), None
patent: 57-48472 (1982-03-01), None
patent: 58-223561 (1983-12-01), None
patent: 59-19671 (1984-02-01), None
patent: 60-8189 (1985-03-01), None
patent: 61-152357 (1986-07-01), None
patent: 63-207559 (1988-08-01), None
patent: 4-334025 (1992-11-01), None
patent: 5-152262 (1993-06-01), None
patent: 6-99348 (1994-04-01), None
patent: 6-252110 (1994-09-01), None
“Planarization by Chemical-Mechanical Polishing for Multilevel Metal Integrated Circuits”, William C. O'Mara, 1994, pp. 37, 62-64.
U.S. Appl. No. 09/804,234, filed Mar. 13, 2001, Okumura et al. (specifications, claims, drawings and declarations).
U.S. Appl. No. 09/804,233, filed Mar. 13, 2001, Okumura et al. (specifications, claims, drawings and declarations).
U.S. Appl. No. 09/804,231, filed Mar. 13, 2001, Okumura et al. (specifications, claims, drawings and declarations).
Patent Abstracts Of Japan, vol. 12, No. 485(mm-777), Dec. 19, 1988.
Patent Abstracts Of Japan, vol. 8, No. 80 (M-289), Apr. 12, 1994.

Affiliated with

Also associated with

Rating

Method and apparatus for dry-in, dry-out polishing and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for dry-in, dry-out polishing and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for dry-in, dry-out polishing and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3501547