Method and apparatus for doubling back single gauge lead frame

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

174 522, 257676, H01L 2302

Patent

active

059692936

ABSTRACT:
A single gauge lead frame having a second support pad which is substantially a mirror image of a first support pad is disclosed. The second support pad is capable of being placed upon the first support pad. In this manner, the structural and thermally conductive advantages of a dual gauge lead frame is realized at a cost near a single gauge lead frame.

REFERENCES:
patent: 4633582 (1987-01-01), Ching et al.
patent: 4791473 (1988-12-01), Phy
patent: 4809054 (1989-02-01), Waldner

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