Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-06-14
2011-06-14
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679540, C361S704000, C361S709000, C361S710000, C165S080300, C165S104320, C165S104330, C165S185000, C257S707000, C257S718000, C257S719000
Reexamination Certificate
active
07961469
ABSTRACT:
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
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Blanco, Jr. Richard Lidio
Heirich Douglas L
Hillman Michael D
Mort Phillip L
Nigen Jay S
Apple Inc.
Datskovskiy Michael V
Jones Anthony P.
Park Vaughan Fleming & Dowler LLP
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