Method and apparatus for dissipating thermal energy

Details Method and apparatus for dissipating thermal energy Method and apparatus for dissipating thermal energy

1994-09-08

1996-01-23

Flanigan, Allen J.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165121, 165185, 257722, H05K 720

Patent

active

054869803

ABSTRACT:
Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0.degree. C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6.degree. C. in.sup.3 /W.

REFERENCES:
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patent: 4884331 (1989-12-01), Hinshaw
patent: 5304846 (1994-04-01), Azar et al.
patent: 5309983 (1994-05-01), Bailey
"Thermal Management: Cooling Microprossors", Special Supplement to Electronic Packaging & Production, Jul. 1992.
Reprint from Thermalloy 1991 Catalog; Plastic Power Heat Sinks; Extruded Power Heat Sinks.

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