Method and apparatus for dissipating heat in an electronic devic

Details Method and apparatus for dissipating heat in an electronic devic Method and apparatus for dissipating heat in an electronic devic

1993-12-14

1996-09-03

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257713, 257718, 257722, 361690, 361718, H01L 2334

Patent

active

055526349

ABSTRACT:
Method and apparatus for cooling an electronic dissipate heat. The method includes the steps of providing a heat sink made from a powdered metal, placing the heat sink in thermal communication with the electronic device and, in one preferred embodiment, circulating an ambient fluid about the heat sink. The heat sink may have a first portion configured to be in thermal communication with the electronic device and a second portion configured to dissipate heat to an ambient fluid. In one preferred embodiment the powdered metal used to form the heat sink includes copper. The powdered metal forming the heat sink may also be at least partially fused. The heat sink structure may be an integral portion of a package for an integrated circuit structure. The heat sink may alternatively be secured to the electronic device with a thermally conductive adhesive. One configuration of the heat sink may include a plurality of posts projecting from a generally flat surface.

REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4733293 (1988-03-01), Gabuzda
patent: 4788627 (1988-11-01), Ehlert et al.
patent: 5172301 (1992-12-01), Schneider
patent: 5175612 (1992-12-01), Long et al.

Affiliated with

Also associated with

Rating

Method and apparatus for dissipating heat in an electronic devic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for dissipating heat in an electronic devic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for dissipating heat in an electronic devic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1952151