Method and apparatus for dissipating heat from an enclosed print

Details Method and apparatus for dissipating heat from an enclosed print Method and apparatus for dissipating heat from an enclosed print

1998-06-16

2000-02-22

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257723, 257712, H01L 2336

Patent

active

060283556

ABSTRACT:
A housing encloses a multi-layer printed wiring board. A set of mounting heat sinks is fitted through the housing and contacts the multi-layer printed wiring board. The set of mounting heat sinks dissipates heat from the printed wiring board and is used to mount the printed wiring board to a wall.

REFERENCES:
patent: 4939570 (1990-07-01), Bickford et al.
patent: 5262927 (1993-11-01), Chia et al.
patent: 5387815 (1995-02-01), Nishiguchi
patent: 5525835 (1996-06-01), Nishiguchi
patent: 5583377 (1996-12-01), Higgins, III
"Microelectronics Packaging Handbook" Semiconductor Packaging, Part II, Second Edition; R.R. Tummala, E.J. Rymaszewski, A.g. Klopfenstein; Chapman & Hall, International Thomson Publishing (1977); pp. II63-II64, II-117.

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