Method and apparatus for dispensing viscous materials

Details Method and apparatus for dispensing viscous materials Method and apparatus for dispensing viscous materials

1986-02-18

1986-11-11

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118410, 118600, 118694, 118406, 427282, H05K 322

Patent

active

046222391

ABSTRACT:
An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous material, such as solder paste therein through successively larger sized openings (76-76) so the paste is distributed evenly beneath the piston. A pair of elastomeric blades (50-50) are secured to, and depend from the housing on opposite sides of a slot (46) to contact the stencil (24). Upon the application of a fluid pressure against the piston, paste will be expelled from the slot within a working region (96) between the blades. The blades force paste into the openings in the stencil when the housing is moved thereacross.

REFERENCES:
patent: 3302564 (1967-02-01), Wilford
patent: 3717121 (1973-02-01), Bruckbauer
patent: 4515297 (1985-05-01), Schoenthaler
patent: 4552778 (1985-11-01), Zimmer

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