Method and apparatus for dispensing solder paste

Details Method and apparatus for dispensing solder paste Method and apparatus for dispensing solder paste

1984-12-31

1987-01-13

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29829, 29840, 427282, 118406, H05K 312, H05K 334

Patent

active

046364064

ABSTRACT:
A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the board is mounted onto an assembled product or it can be a portion of the product itself. The surface can be a planar or non-planar surface.

REFERENCES:
patent: 4324815 (1982-04-01), Mitani et al.
patent: 4469044 (1984-09-01), Bloom et al.
patent: 4515297 (1985-05-01), Schoenthaler
patent: 4515304 (1985-05-01), Berger

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