Method and apparatus for direct writing of semiconductor die usi

Details Method and apparatus for direct writing of semiconductor die usi Method and apparatus for direct writing of semiconductor die usi

1998-03-20

2000-11-14

Eickholt, Eugene

Printing

Planographic

Lithographic plate making, and processes of making or using...

2504911, 25049222, 430296, 378 34, 378 35, B41C 105, H01J 37304, G03C 500

Patent

active

061454389

ABSTRACT:
In electron beam lithography, a lithography system uses multiple microcolumns in an array to increase throughput for direct writing of semiconductor wafers. The mismatch between the microcolumn array and the semiconductor die periodicity is resolved by using only one microcolumn to scan each individual die. This is accomplished by assuring that the stage carrying the semiconductor wafer moves a total distance in each of the X and Y directions which is greater than the pitch between adjacent die. Hence each die is scanned by only a single microcolumn although at possibly different times during the total stage motion.

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