Method and apparatus for direct bonding two bodies

Details Method and apparatus for direct bonding two bodies Method and apparatus for direct bonding two bodies

1994-02-16

1995-06-06

Powell, William

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Etching improves or promotes adherence of preforms being bonded

1562722, 1563796, 156345, 216 62, 216 66, 216 69, H01L 21306, B44C 122, B32B 3100, C03C 1500

Patent

active

054219531

ABSTRACT:
Bodies of at least one material are held in a contacting holder 12 in a vacuum chamber. The surfaces of the bodies are cleaned by a low energy ion etching. Water vapor from a pure water bottle is supplied through a nozzle as a water molecule beam so that water molecules and hydroxide groups are chemically adsorbed on the surfaces of the bodies. A plasma beam or microwaves are applied to the surfaces of the bodies to remove the water molecules and leave only hydroxide groups remaining on the surfaces. The holder is operated to bring the surfaces of the bodies into contact with each other, to thereby obtain direct bonding of the bodies.

REFERENCES:
patent: 4671846 (1987-06-01), Shimbo et al.
patent: 5100839 (1992-03-01), Terao
patent: 5204282 (1993-04-01), Tsuruta et al.
patent: 5223450 (1993-06-01), Fujino et al.
G. Spierings et al, "Diversity And Interfacial Phenomena In Direct Bonding", pp. 18-33.
T. Suga, "Nikki New Materials", Joining Ceramics, with translation of pp. 74-75, Sep. 14, 1992.

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