Method and apparatus for dip solder processing

Details Method and apparatus for dip solder processing Method and apparatus for dip solder processing

1996-12-19

1998-12-08

Ryan, Patrick

Metal fusion bonding

Process

Applying or distributing fused filler

228 36, 228 562, 118421, 118422, 427431, H05K 334, B23K 108

Patent

active

058458395

ABSTRACT:
A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface contamination. Continued immersion of the plunger during the soldering operation of the workpiece accomplishes continual flow across the soldered workpiece thereby removing any contaminants which rise to the surface or are introduced by the workpiece.

REFERENCES:
patent: 3570741 (1971-03-01), Corsaro
patent: 3738312 (1973-06-01), Padjen et al.
patent: 3779056 (1973-12-01), Padjen et al.
patent: 4113165 (1978-09-01), Ott
patent: 5087356 (1992-02-01), Webb
patent: 5192014 (1993-03-01), Ciniglio et al.
patent: 5372293 (1994-12-01), Corlay et al.

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