Method and apparatus for die testing on wafer

Details Method and apparatus for die testing on wafer Method and apparatus for die testing on wafer

2008-04-22

2008-04-22

Pert, Evan (Department: 2826)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010

Reexamination Certificate

active

07362120

ABSTRACT:
An integrated circuit includes switching means for selectively connecting the bond pads to functional core logic and isolating the bond pads from second conductors, and the switch means for selectively connecting the bond pads to the second conductors to provide bi-directional connections between the bond pads on opposite sides of the substrate and isolating the bond pads from the functional core logic.

REFERENCES:
patent: 2245681 (1990-10-01), None

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