Method and apparatus for die-bonding semiconductor chip bonding

Details Method and apparatus for die-bonding semiconductor chip bonding Method and apparatus for die-bonding semiconductor chip bonding

1988-03-16

1989-07-04

Jordan, M.

Metal fusion bonding

Process

Plural joints

228 20, B23K 3102

Patent

active

048443255

ABSTRACT:
A process of die-bonding a semiconductor chip. The semiconductor chip is sucked by a collet and fixed on a preform which is formed on a die pad. A load is applied to the chip and a gas is blown around the semiconductor chip. so as to flatten any of the preform that has gone beyond the interface between the chip and die pad. The entire assembly is heated thereby curing the preform. In a preferred embodiment the semiconductor chip is sucked with the collet via a vacuum pump and an inert gas is blown around the semiconductor chip.

REFERENCES:
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4274576 (1981-06-01), Shariff
patent: 4295596 (1981-10-01), Doten et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4634043 (1987-01-01), Avedissian
patent: 4752025 (1988-06-01), Stach et al.

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