Method and apparatus for die bonding

Details Method and apparatus for die bonding Method and apparatus for die bonding

1989-03-08

1990-04-03

Godici, Nicholas P.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, 2281802, 228 62, 228 9, 269903, 221155, 221163, 221167, H01L 2160

Patent

active

049133357

ABSTRACT:
Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.

REFERENCES:
patent: 4103814 (1978-08-01), Nishioka
patent: 4342090 (1982-07-01), Caccoma et al.
patent: 4696104 (1987-09-01), Vanzetti et al.
IBM Technical Disclosure Bulletin vol. 28, No. 11, Apr. 1986.
IBM Technical Disclosure Bulletin vol. 29, No. 7, Dec. 1986.
IBM Technical Disclosure Bulletin vol. 30, No. 10, Mar. 1988.

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