Method and apparatus for dicing semiconductor wafers

Details Method and apparatus for dicing semiconductor wafers Method and apparatus for dicing semiconductor wafers

1996-02-12

1999-05-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438462, 438464, H01L21/301;21/46;21/78

Patent

active

059045469

ABSTRACT:
A method and apparatus for dicing semiconductor wafers is provided. The method comprises: forming an etch mask on the wafer, and then etching the wafer with a wet etchant, such as KOH, to form a peripheral groove around each die. Etching the wafer can be from the front side of the wafer, from the back side of the wafer or with partial etches from both sides. The etch process can be performed on a single wafer using a spray head apparatus or on batches of wafers using a recirculating dip tank apparatus.

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