Stone working – Sawing – Reciprocating
Patent
1995-03-31
1997-03-11
Kisliuk, Bruce M.
Stone working
Sawing
Reciprocating
451364, 451388, 451385, B28D 106
Patent
active
056091486
ABSTRACT:
A method and apparatus for dicing a semiconductor wafer in which the wafer is bowed or bent by forcing it into contact with a spherical surface having parallel grooves therein and in which an array of parallel wire saws that are in registration with the grooves is forced against the wafer for sawing parallel channels therethrough. A second array of parallel wire saws that are orthogonal to the wires of the first array is provided spaced therefrom for sawing parallel channels through the wafer that are orthogonal to the channels produced by the first array of parallel wire saws.
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Mitwalsky Alexander
Okumura Katsuya
Ahmed Adel A.
Kabushiki Kaisha Toshiba
Kisliuk Bruce M.
Nguyen George
Siemens Aktiengesellschaft
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