Method and apparatus for dicing a substrate

Details Method and apparatus for dicing a substrate Method and apparatus for dicing a substrate

1996-07-05

1999-06-29

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912172, 21912184, 438463, B23K 2600

Patent

active

059164603

ABSTRACT:
A laser device dices a substrate by generating a continuous wave-oscillation laser beam 3 that is converged by a lens 4 and focused at a predetermined focus O between the surface of the substrate 1 and a tip of a nozzle of a guide 5. Then, the focus is expanded to result in a laser beam 3a having a beam spot diameter of S at the surface of the substrate 1. A flow of assist gas G.sub.0, G.sub.1, G.sub.2 having a predetermined constant pressure is supplied from a gas intake 6 surrounding the laser beam 3. As the laser beam 3a is defocused, the beam spot diameter S is expanded and its energy distribution is moderated. The gas is blown onto the substrate 1 at constant pressure in order to suppress generation of strains due to thermal deformation.

REFERENCES:
patent: 3629545 (1971-12-01), Graham et al.
patent: 3749878 (1973-07-01), Sullivan et al.
patent: 4224101 (1980-09-01), Tijburg et al.
patent: 4467168 (1984-08-01), Morgan et al.
patent: 4543464 (1985-09-01), Takeuchi
patent: 4945207 (1990-07-01), Arai
patent: 5040185 (1991-08-01), Hill
patent: 5214261 (1993-05-01), Zapella
patent: 5239160 (1993-08-01), Sakura et al.
patent: 5641416 (1997-06-01), Chadha

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