Method and apparatus for determining wafer quality profiles

Details Method and apparatus for determining wafer quality profiles Method and apparatus for determining wafer quality profiles

2005-03-15

2005-03-15

Nghiem, Michael (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

C700S108000, C700S109000, C438S016000, C438S017000, C438S018000

Reexamination Certificate

active

06868353

ABSTRACT:
A method includes processing a workpiece in a process flow. Workpiece state trace data is collected for the workpiece during its processing in the process flow. A quality profile of the workpiece is generated based on the workpiece state trace data. A manufacturing system includes a plurality of tools configured to process a workpiece in a process flow and a quality monitor. The quality monitor is configured to collect workpiece slate trace data for the workpiece during its processing in the process flow generate a quality profile of the workpiece based on the workpiece state trace data.

REFERENCES:
patent: 5661669 (1997-08-01), Mozumder et al.
patent: 6292582 (2001-09-01), Lin et al.
patent: 6601411 (2003-08-01), MacDougall et al.
patent: 6650955 (2003-11-01), Sonderman et al.
patent: 6691068 (2004-02-01), Freed et al.

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