Method and apparatus for determining the stability of an...

Details Method and apparatus for determining the stability of an... Method and apparatus for determining the stability of an...

2011-04-26

2011-04-26

Griffin, Walter D (Department: 1774)

Chemistry: analytical and immunological testing

Including titration or ph determination

C422S075000, C422S068100, C422S050000

Reexamination Certificate

active

07932094

ABSTRACT:
The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint. The quantity of titrant required to attain the endpoint provides a measure of the stability of the electroless plating bath.

REFERENCES:
patent: 4762601 (1988-08-01), Krulik et al.
patent: 4774101 (1988-09-01), Harris et al.
patent: 4904506 (1990-02-01), Burnett et al.
patent: 4950610 (1990-08-01), Tittle
patent: 2008/0241401 (2008-10-01), Choi et al.
Yin X., et al, Modeling the stability of electroless plating bath-diffusion of nickel colloidal particles from the plating frontier, Journal of Colloid and Interfaces Science, 2003, 262, 89-96.

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