Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-03-27
2007-03-27
Koch, George (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S083000, C156S084000
Reexamination Certificate
active
10985939
ABSTRACT:
An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
REFERENCES:
patent: 5711989 (1998-01-01), Ciardella et al.
patent: 6023666 (2000-02-01), Jiang et al.
patent: 2001/0012706 (2001-08-01), Imaeda
patent: 2003/0068842 (2003-04-01), Tojo et al.
patent: 8-107268 (1996-04-01), None
Eguchi Shinzou
Kobayashi Sakae
Murata Kazuhiro
Yamamoto Akihiro
Yoshida Kouichi
Koch George
Wenderoth , Lind & Ponack, L.L.P.
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