Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Reexamination Certificate
2005-05-10
2005-05-10
Fiorilla, Chris (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
C156S358000, C156S359000, C156S360000, C156S367000, C156S378000, C156S379000
Reexamination Certificate
active
06889738
ABSTRACT:
An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
REFERENCES:
patent: 5711989 (1998-01-01), Ciardella et al.
patent: 6023666 (2000-02-01), Jiang et al.
patent: 8-107268 (1996-04-01), None
Eguchi Shinzou
Kobayashi Sakae
Murata Kazuhiro
Yamamoto Akihiro
Yoshida Kouichi
Fiorilla Chris
Koch George
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