Method and apparatus for determining film thickness control cond

Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427240, 118712, 118 52, 118667, B05D 312, B05C 1102

Patent

active

060250127

ABSTRACT:
The present invention provides an apparatus which is capable of discharging a process liquid to a rotating substrate at a very constant rate irrespective of variations in the state of the process liquid. A process liquid is discharged toward a rotating substrate by nozzles which are moved from inner to outer radius sides of the rotating substrate. The present invention further provides a method in which film thickness control conditions are determined based on a simulation of a behavior of a process liquid on a substrate.

REFERENCES:
patent: 5127362 (1992-07-01), Iwatsu et al.
patent: 5250116 (1993-10-01), Tanimoto

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for determining film thickness control cond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for determining film thickness control cond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for determining film thickness control cond will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1903899

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.